3D-Micromac has introduced a new, advanced microSPIN laser micromachining system. The laser device is suitable for thin film materials that are normally handled using a Roll-to-Roll transportation equipment.
The laser micromachining can be made to have a 2.8 m/s roll speed by using its advanced picture recognition system. The laser micromachining system can handle any type of material. It can process thin film layer substrates and plastic materials of varying thickness. Laser machining of delicate silicon wafers offers a number of advantages such as accurate control over energy supply, flexible beam guidance and contactless energy insertion.
3D-Micromac offers both stand-alone and integrated systems for laser machining of solar cells. The company develops and produces various laser micromachining workstations for science, research and industry. The laser systems are deployed in facilities to process semiconductors and manufacture photovoltaic systems
Types of processes utilized with laser micromachining are 3D and 2D structuring, cutting, signing, micro drilling and marking of thin films and materials.
Source: http://www.3dmicromac.com