Jul 27 2010
The adaptive photonic switching company CALIENT Technologies announced the new CALIENT 3D MEMS Inside strategy for its photonic switching technology market expansion. The new strategy is also for creating partnerships with optical transport, packet switching, server, and router vendors.
The 3D MEMS (microelectromechanical systems) technology of CALIENT swaps the fiber-optic signals from one port to another with the help of silicon micro mirrors. The company has used its deep-silicon plasma etch process technology to produce the 3D MEMS mirrors. The FiberConnect 320X platform of CALIENT provides high-density photonic switch featuring 640 fiber terminations. The platform is being shipped to many Tier 1 service providers for eight years. The installed base of the product is 70,000 fiber terminations.
The aim of the CALIENT 3D MEMS Inside strategy is to manufacture a significantly small, advanced switch module. The company plans to further decrease the consumption of power to approximately 10% of the current switching systems. The target of the new products will be content provider, cloud computing, and data center applications.
The Chairman of CALIENT, Arjun Gupta, stated that the company has announced the strategy to utilize the various market trends that range from high bandwidth demand for video to the onset of CDC networks. Gupta also said that the company’s new photonic switches would satisfy the increasing demand for bandwidth cost-effectively, without a considerable increase in the consumption of power.
Source: http://www.calient.net/