Teledyne DALSA is a Teledyne Technologies (NYSE: TDY) company and a world leader in machine vision technology. It takes pleasure in announcing its new Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras with the potential to redefine performance and featuring the new On-Semiconductor and E2V sensors.
The new Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras, offers the industry’s smallest form factor with 25 million pixels at 80 fps. (Image credit: Teledyne DALSA)
These modern market-leading image CMOS sensors possess 16–67 megapixel resolution with additional and confirmed CoaXPress 6.25 Gbps technology that can provide robust build quality for various operating temperatures, maximum speed, and an unmatched feature set at an unbelievable price.
The sensors are perfectly complemented by the half-length Xtium-CXP frame grabber and have been developed to work synergistically, reducing CPU usage and enhancing working times for host applications by allowing ready-to-use image data and maximum sustained throughput.
These new Genie Nano-CXP cameras with 25 million pixels at 80 fps in a small form factor are developed to produce high speed, reliable results for applications like electronics manufacturing, semiconductor wafer inspection, machine vision, and solar panel inspection.
Key Features:
- Smallest 25M CXP cameras in the industry
- First four models with 16M and 25M provided in both monochrome and NIR enhanced versions
- Trigger-to-Image Reliability (T2IR) framework enhances the reliability of the inspection system and protects from data loss
- Rugged all-metal body with a warranty of 3 years
- GenICam, GenCP compliant