Posted in | Infrared Cameras

Compact LWIR Thermal Camera Core - Boson®

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP).  It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low.  The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions — 640 x 512 or 320 x 256. It is available with multiple lens configurations adding flexibility to integration programs.

With a weight as low as 7.5g and a camera body of only 21 x 21 x 11mm (0.83 x 0.83 x 0.43 in) without lens or 640-model shutter, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

Dramatic Reduction in Size, Weight and Power (SWaP) With No Reduction in Performance

A full-featured VGA thermal camera module at less than 4.9 cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5 g
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions
  • Rugged construction and highest temperature rating -40°C to 80°C

Powerful Infrared Video Processing Architecture

FLIR’s infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

  • Includes embedded algorithms for noise filters, gain control, blending, and more
  • Software-customizable functionality for video processing and power dissipation requirements
  • Built-in support for physical and protocol-level interface standards

Wide Configurability for Faster Development and Lower Cost-to-Market

Unprecedented integration flexibility for fast, affordable developments

  • Customized applications through FLIR trusted third-party developers
  • Variety of hardware and image processing integration to fit OEM requirements
  • Mechanical/electrical compatibility across all versions

Boson Specifications

Sensor Technology Uncooled VOx Microbolometer
Array Format 320 × 256 or 640 × 512
Pixel Pitch 12 μm
Spectral Range Longwave infrared: 7.5 µm – 14 µm
Thermal Sensitivity <40 mK (Industrial); <50 mK (Professional); <60 mK (Consumer)
Full Frame Rate 60 Hz baseline; 30 Hz runtime selectable
Slow Frame Rate ≤9 Hz available
Non-uniformity Correction NUC Factory calibrated; updated FFCs with FLIR Silent Shutterless NUC (SSN™)
Solar Protection Integral
Continuous Electronic Zoom 2X zoom
Symbol Overlay Re-writable each frame; alpha blending for translucent overlay
Array Format 320 x 256 640 x 512
HFOV; effective focal length HFOV; effective focal length
92°; 2.3 mm 95°; 4.9 mm
50°; 4.3 mm 50°; 8.7 mm
34°; 6.3 mm 32°; 14.0 mm
24°; 9.1 mm 24°; 18.0 mm
16°; 13.8 mm 18°; 24.0 mm
12°; 18.0 mm 12°; 36.0 mm
6°; 36.0 mm 8.0°; 55.0 mm
4.0°; 55.0 mm 6°; 73 mm
Input voltage 3.3 VDC
Power dissipation Varies by configuration; as low as 500 mW
Video channels CMOS or USB-2
Control channels UART or USB
Configurable GPIO  
Up to 11; User configurable
Mechanical Environmental
Size 21 × 21 × 11 mm (0.83 x 0.83 x 0.43 in) without lens or 640-model shutter
Weight 7.5 g without lens (configuration dependent)
Precision mounting holes Four tapped M16 x 0.35 (rear cover). Lens support recommended when lens mass exceeds core mass
Operating temperature range -40 °C to 80 °C  (-40°F to 176°F)
Non-operating temperature range -50 °C to 105 °C   (-58°F to 221°F)
Shock 1,500 g @ 0.4 msec
Operational altitude 12 km (40,000 ft) Max altitude of a commercial airliner or airborne platform.

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