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Cree Metal Cans from Marktech Optoelectronics

DA LED Chip Series

Cree's Direct Attached LED die is available with a bondpad-down design that permits eutectic die attach, eliminating the requirement for wire bonds, and enables greater performance from enhanced thermal management.

GaN LED Chip Series

CB Super Blue Chips permit low current and provide the ultimate price/performance for blue LEDs.

Cree's TR™ LEDs are the latest generation of solid-state LED emitters that incorporate highly efficient InGaN materials with Cree's proprietary device technology and silicon carbide substrates in order to deliver greater value for the LCD sideview market. The TR LEDs are known to be among the brightest in the sideview market while providing a low forward voltage resulting in an extremely bright and highly efficient solution for the 0.4 mm, 0.6 mm and 0.8 mm sideview market. The design is optimally suitable for industry-standard sideview packages since it is die attachable with clear epoxy and comprises of two top contacts, reliable with industry-standard packaging.

EZ LEDs incorporate highly efficient InGaN materials with Cree's proprietary optical design and wafer-level submount technology in order to provide greater value for high-intensity LEDs. The optical design maximizes the efficiency of light extraction and enables a Lambertian radiation pattern suitable for a number of applications.

Cree's MB Generation II series of MegaBright© LEDs incorporate highly efficient InGaN materials with Cree's proprietary G•SiC© substrate in order to deliver superior price/performance for high-intensity LEDs. These LED chips comprise of a geometrically improved vertical chip structure for maximizing light extraction efficiency and need just a single wire bond connection. Sorted die kits offer die sheets that are effortlessly sorted into wavelength and radiant flux bins. Cree's MB series chips are tested for conformity to electrical and optical specifications and the potential to withstand 1000V ESD.

These LEDs are employed in an extensive range of applications such as automotive lighting and white LEDs, outdoor full-motion LED video signs, and yet can also be used in LCD backlighting and other such high-volume applications. Cree's MB series chips are well-matched with most radial and SMT LED assembly processes.

Razor Thin LED Chip Series

Cree RT LEDs deliver superior performance/price for high-intensity green and blue LEDs. They are best suited for applications where thinner form factors are needed, such as

  • Automotive applications
  • LCD backlighting units
  • LED video displays
  • Audio product display lighting
  • Mobile appliance keypads
  • Cellular phone LCD backlighting

Cree's original RT LEDs are available in two lines, the 290 and 230, both of which are available in 5 mA and 20 mA versions. The new RT Gen III LEDs are offered in three lines, the 200, 320 and 260.

Like all Cree LEDs, RT LEDs integrate greatly efficient InGaN materials with Cree's proprietary G•SiC® substrate. Additionally, these LEDs have a single wire-bond structure. Cree RT series chips are considered to be compatible with most radial and SMT LED assembly processes.

Cree's UltraThin© LEDs integrate highly efficient InGaN materials with Cree's proprietary G•SiC© substrate in order to deliver superior performance/price for blue LEDs. These vertically structured LED chips are small in size and need a low forward voltage. Cree's UT™ series chips are tested for conformity to electrical and optical specifications and the potential to withstand 1000-V ESD.

Applications cover keypad backlighting where sub-miniaturization and thinner form factors are needed.

Cree UT LEDs are available in three lines, 190, 230 and 200. Their features include:

  • Small chip
  • Class 2 ESD rating
  • Single wire bond structure

Like all Cree LEDs, UT LEDs incorporate greatly efficient InGaN materials with Cree's proprietary G•SiC® substrate in order to deliver superior performance/price for high-intensity LEDs. These LED chips have a geometrically improved design for maximizing light-extraction efficiency.

Cree UT series chips are well-matched with most radial and SMT LED assembly processes.

XThin LEDs

Cree's XT line of LEDs are perfect for applications where high brightness and sub-miniaturization are needed. Such applications include:

  • Cellular phone backlighting
  • Audio product display lighting
  • ESS / outdoor displays
  • Digital camera flash for mobile appliances
  • Mobile phone keypads in white, green or blue

Like all Cree LEDs, XT LEDs incorporate greatly efficient InGaN materials with Cree's proprietary G•SiC® substrate in order to deliver superior price/performance for high-intensity LEDs. These LED chips are available with a geometrically advanced Epi-down design in order to maximize die-to-package heat dissipation and light extraction efficiency.

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