March Plasma Systems is global leader in gas plasma technology for Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science / medical device industries. The company designs and manufactures a complete line of automated and batch plasma treatment systems, and maintains an expert staff of scientists and engineers trained in plasma science for advanced packaging and PCB technology.
High reliability and high yield of advanced integrated circuits can be difficult to achieve as package size decreases and use of advanced materials increases. Gas plasma treatment before die attach, wire bonding, encapsulation, and underfill increases bond strengths.
For PCB manufacturing, plasma technology can deliver higher uniformity and reproducibility than chemical or mechanical processes. Plasma treatment increases the surface energy of advanced materials, including Teflon®, providing excellent lamination and wettability for plating through-holes. Plasma also removes
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