Laser Ablation of Materials with Ultrashort-Pulse Laser Structuring

For both scientific research and for industrial applications, laser material processing is of great interest. Two of the key benefits of using lasers as a manufacturing tool are the high speed at which it is possible to move a laser beam and in contrast to mechanical tools, laser light is not subject to wear and tear.

Other than the wavelength, the laser source’s pulse duration is the key parameter influencing the laser material coupling nature. State-of-the-art laser systems feature pulse durations down to a few femto seconds. The high peak intensities offered by ultrashort pulses initiate multiphoton absorption mechanisms, bridging a larger band gap than the photon energy.

Hence by applying ultrashort pulses the ablation of virtually any material is possible by multiphoton absorption. The non-thermal nature of ultrashort pulsed ablation together with the ultrafast mechanism offers well-defined ablation threshold fluences and enables laser structuring with high precision.

Surface Structuring of AlO₂ Ceramics

Figures 1 and 2 show surface structuring of AlO₂ ceramics

Figure 2. Lasercut Al₂O₃ ceramics with goldcoating on the top surface

Surface Structuring and Cutting of Dielectrics and Semiconductors

Figures 3 and 4 show laser ablation in surface structuring and cutting of semiconductors and dielectrics.

Cutting and Structuring of Polymers (Sensors and Microfluidic Devices)

Figures 5 and 6 show laser ablation in cutting and structuring of polymers.

Thin Film Ablation (for Automotive Sensor)

Figures 7 and 8 show laser ablation for thin film ablation.

Cutting and Drilling of Metals

Figures 9 and 10 show laser ablation for cutting and drilling of materials.

This information has been sourced, reviewed and adapted from materials provided by Spectra-Physics.

For more information on this source, please visit Spectra-Physics.