For both scientific research and for industrial applications, laser material processing is of great interest. Two of the key benefits of using lasers as a manufacturing tool are the high speed at which it is possible to move a laser beam and in contrast to mechanical tools, laser light is not subject to wear and tear.
Other than the wavelength, the laser source’s pulse duration is the key parameter influencing the laser material coupling nature. State-of-the-art laser systems feature pulse durations down to a few femto seconds. The high peak intensities offered by ultrashort pulses initiate multiphoton absorption mechanisms, bridging a larger band gap than the photon energy.
Hence by applying ultrashort pulses the ablation of virtually any material is possible by multiphoton absorption. The non-thermal nature of ultrashort pulsed ablation together with the ultrafast mechanism offers well-defined ablation threshold fluences and enables laser structuring with high precision.
Surface Structuring of AlO2 Ceramics
Figures 1 and 2 show surface structuring of AlO2 ceramics
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Figure 1 |
MATERIAL |
LASER |
τ = 350 fs |
Ceramic Al2O3 |
Spirit® |
λ = 1040 nm |
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Figure 2. Lasercut Al2O3 ceramics with goldcoating on the top surface
Surface Structuring and Cutting of Dielectrics and Semiconductors
Figures 3 and 4 show laser ablation in surface structuring and cutting of semiconductors and dielectrics.
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Figure 3 |
MATERIAL |
LASER |
τ = 350 fs |
Borosilicate glass |
Spirit |
λ = 1040 nm |
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Picture 4 |
MATERIAL |
LASER |
τ = 350 fs |
3C-SiC |
Spirit |
λ = 1040 nm |
Cutting and Structuring of Polymers (Sensors and Microfluidic Devices)
Figures 5 and 6 show laser ablation in cutting and structuring of polymers.
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Figure 5 |
MATERIAL |
LASER |
τ = 350 fs |
Polymersensor |
Spirit |
λ = 1040 nm |
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Figure 6 |
MATERIAL |
LASER |
τ = 350 fs |
SU-8 on glass |
Spirit |
λ = 520 nm |
Thin Film Ablation (for Automotive Sensor)
Figures 7 and 8 show laser ablation for thin film ablation.
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Figure 7 |
MATERIAL |
LASER |
τ = 350 fs |
Silver on ceramics |
Spirit |
λ = 1040 nm |
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Figure 8 |
MATERIAL |
LASER |
τ = 350 fs |
Au/Ag on ceramics |
Spirit |
λ = 1040 nm |
Cutting and Drilling of Metals
Figures 9 and 10 show laser ablation for cutting and drilling of materials.
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Figure 9 |
MATERIAL |
LASER |
τ = 350 fs |
Amorphous metal |
Spirit |
λ = 1040 nm |
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Figure 10 |
MATERIAL |
LASER |
τ = 12 ps |
Steel |
Spirit ps |
λ = 1062 nm |

This information has been sourced, reviewed and adapted from materials provided by Spectra-Physics.
For more information on this source, please visit Spectra-Physics.