How to Customize Your Optoelectronics

Table of Contents

Introduction
Customized Assemblies
Pursuing a Custom Device
     Emitter Selection (Cree and Marktech UV, Visible, and NIR/SWIR Chips)
     Detector Selection (Photo Transistors, and Photodiodes with the Ability to Detect Light in the UV, Visible, and Infrared Spectrums)
     Packaging Selection
     Test Services
     Manufacturing
Application Support
Test Services
Manufacturing
     LED Assembly Capabilities
     To Get Started Marktech May Need
Conclusion

Introduction

In this fifth installment of the five-part series on Marktech’s capabilities, the authors shed light on the overall steps that can be undertaken to extend customization as a solution for the application needs of customers.

Marktech has over 30 years of experience in optoelectronics. Using this vast experience, the customization process at Marktech concentrates on customer requirements and applications. Rather than using standardized—but maybe non-optimized—parts, Marktech permits beneficial custom product modifications to improve a customer’s product design needs. Marktech Optoelectronics has resolved demanding LED assembly, design, and manufacturing challenges for a broad array of customers. Marktech’s market focus and company size, along with 30+ years of marketing and engineering experience, permit it to provide customized modifications of products that are not offered by conventional suppliers of optoelectronics. Adequate resources are offered for packaging options, expert and testing advice, component selection, providing the designer with insights into custom variations that can be influenced to enhance optical, electrical, and thermal characteristics—without the necessity for huge volume commitments.

Customized Assemblies

Customized assemblies can afford prototypes for evaluation test products, what-if product builds, and products using the specific detector and emitter chips required for challenging customer applications.

Pursuing a Custom Device

To develop a custom device that provides solutions to the needs of a customer—from proof-of-concept to production and launch— engineers from Marktech will collaborate with the customer on the mentioned areas, which are described in the following list:

Application support for needs specific to a customer’s project

Component optimization recommendations involving technology selection (refer to Product Selector Guide) and assembly packaging, including:

Emitter Selection (Cree and Marktech UV, Visible, and NIR/SWIR Chips)

  • Multichip emitters and chip-on-board packaging
  • High-power and high-brightness LEDs
  • Single or multi-chip LED packages or modules for multiple wavelength applications
  • Ultraviolet, infrared, and visible LED emitters
  • Single or multiple LED die configurations

Detector Selection (Photo Transistors, and Photodiodes with the Ability to Detect Light in the UV, Visible, and Infrared Spectrums)

  • Specialty photodetectors (GaP Schottky)
  • Avalanche photodiodes and silicon phototransistors
  • Standard photovoltaic silicon photodiodes
  • InGaAs/InP epitaxial wafers
  • InGaAs and InP PIN photodiodes

Packaging Selection

  • A wide range of packaging options can be chosen from, including:
  • Plastic 2-, 4-, or 6-leaded surface mount package with no added lens
  • Ceramic surface mount package without or with an added lens
  • 2 mm—5 mm ceramic stem with drip lens encapsulation
  • 8 pin, TO-39 metal can package with multiple lens choices
  • Custom chip-on-board (COB) mounting to metal core PCBs, FR-4 boards, and flex and ceramic polyimide
  • Reflective sensor package for both detectors and emitters

Test Services

The application support extended by Marktech includes environmental test screening, electrical parameter test, and reliability testing for the customer’s specific needs. Testing is supported by a comprehensive onsite components lab with measurement capability for simulation of particular conditions, validation of wavelength, angles, and complete electrical and optical parametric characterization.

Manufacturing

Complete turn-key production capabilities from Epi growth to finished products, and from pilot runs to complete manufacturing are available. Completed assemblies have extended from two chips to 140, with no restrictions on the number of chips that can be mounted. Whether the LED assembly requirements are through-hole, surface mount, or a combination of these two, Marktech provides a hassle-free, efficient, and cost-effective solution to LED assembly-related problems.

Application Support

A discussion with Marktech’s engineers about custom assemblies can provide solutions to the following concerns:

  • Does a customer’s application need multiple chips, either for detection or emission or both?
  • What is the best material for a customer’s assembly: FR-4 to flex, ceramic, or metal core?
  • How many chips are needed based on drive and output conditions? (Marktech has undertaken assemblies extending from two chips to 140; however, there are no restrictions on the number of chips that can be mounted.)
  • Is comprehensive turn-key production required? Marktech can supply this from Epi growth to finished products.

Test Services

Marktech offers tailored testing for the customer’s products, unlike many optoelectronic device manufacturers that will provide only standard parts with standard testing, Marktech has the knowledge, equipment, procedures, and most importantly—the willingness to custom test the parts as required by the customer. Testing is conducted in Marktech’s California, New York, and Japan facilities.

Test equipment includes the following:

  • Oriel Instruments (Newport)
  • Photo Research
  • Gooch and Housego
  • Labsphere
  • Blue M (85/C/85%RH testing)
  • Instrument Systems (Konica Minolta)
  • Tenney (temperature cycling and air to air thermal shock)
  • UV to SWIR detector parametric test (using customized equipment not available in the market)
    • Spectral response
    • Shunt resistance
    • Dark current
    • Quantum efficiency
  • Bare emitter die test with blue membrane tape (pick/test/replace die on tape), as well as tray test/waffle pack.

Keithley electrical characterization

Agilent/HP parametric testing

Manufacturing

With manufacturing facilities in Germany, Japan, and California, Marktech is a vertically-integrated company, affording quick manufacturing of components, thereby decreasing the customer’s time to market. The company can produce a customer’s entire package in the United States if need be.

LED Assembly Capabilities

  • Thru-hole, SMD, and chip-on-board assembly
  • Prototyping
  • High-density pick and place
  • High volume production runs
  • PCB design and fabrication
    • Single or multi-layer
    • FR4, aluminum, and polyimide
    • Rigid or flexible
  • Engineering software capabilities
  • PCB design
  • Schematic capture
  • Simulation
  • CAM and CAD
  • Purchased or consigned materials
  • GenRad functional testing
  • In-circuit testing
  • Reliability testing
  • Potting
  • IPC standard assembly
  • Conformal coating
  • Shipped according to the customer’s packaging requirements
  • Use of the customer’s part numbering system
  • Additional outsourced capabilities include the following:
    • Metalwork fabrication
    • Plastic injection molding

To Get Started Marktech May Need

  • PCB FAB drawing and Gerber files
  • Assembly drawing
  • Bill of Materials (BOM) with manufacturer’s part numbers, name, and circuit references
  • Drawings and BOM for any custom items, transformers, cable assemblies, metal or plastic cases, etc.
  • Conformal coating requirements
  • Is this turnkey or consigned material?
  • Packaging requirements
  • Testing instructions
  • Quantity and proposed delivery schedule
  • Target costs
  • Any special arrangements or existing vendors that Marktech should be made aware of

Conclusion

Marktech provides its customers several choices to attain their goal of having a custom component or assembly device designed to their specific requirements. To achieve this, Marktech presents a broad array of emitter materials extending from 280 nm UV, near IR, the Cree line of visible materials, and SWIR materials. Marktech’s collection of emitter materials is one of the largest commercially available from a single source and extends from 280 nm to 2600 nm with higher wavelengths available.

On the detector side, Marktech offers both silicon. GaP and InGaAs materials. Available wavelengths start at 150 nm (UV) through the visible range (440 to 700 nm), near infrared (710 to 1050 nm, and shortwave infrared (1050 to 1720 nm).

Marktech’s packaging options include both assemblies and components for detectors, emitters, and a combination of both. Packages include multi-chip, surface mount, and chip on board. Design assemblies use star boards, ring lights, and linear boards to name a few.

Marktech is capable of testing any optical and electrical parameter for detectors and emitters. In most cases, this includes plus or minus 1 nanometer for emission.

Marktech Optoelectronics.

This information has been sourced, reviewed and adapted from materials provided by Marktech Optoelectronics.

For more information on this source, please visit Marktech Optoelectronics.

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