Application of infrared (IR) thermography in electrical and electronics engineering:
- Non-contact measurement with no distortion by contacting sensors
- Smallest components require high spatial resolution and short working distances
- Difference image analysis facilitates focused evaluation of deviations from the norm
Non-Contact Measurement of Smallest Components
Thermography plays an important role in the monitoring of electronic components and assemblies for a long time. In this application, a particular advantage of using thermography is the possibility of performing temperature measurements without making any contact, whereas other measurement processes can cause distortions due to contacting sensors, particularly when handling smaller components. Moreover, contact sensors find it difficult to detect smaller structures, and only high spatial resolution of IR camera systems can make single components visible.
Optimization of a processor
Since low electrical power is often required to operate assemblies, temperature changes are also extremely small. Besides an outstanding thermal resolution, methods of active heat flow thermography are, if the circumstances demand, necessary for measurements. Therefore, it is possible to detect damages to electronic assemblies by means of lock-in thermography, even if the assembly itself does not release heat and no hot spots are visible.
A stress test on a power semiconductor
Excellent Interaction Between the IR Camera, its Software and Periphery
An optimal interplay between the IR camera and its software is inevitable. For instance, IRBIS® 3 thermographic software integrates procedures of active heat flow thermography. In addition, the software allows users to compare the current thermal image against a reference image. Therefore, deviations from the norm can be displayed in a clearer manner.
During board (PCB) testing, multiple components result from a large number of different emissivities which might cause deviations from measurement results. To address this issue, an integrated solution is provided by the IRBIS® 3 software to enable users to identify the emissivity of every single pixel.
Thermography of a board
The software IRBIS® 3 is compatible with InfraTec’s IR camera systems and ideally suited for applications in the field of electronics manufacturing. In addition to the highest spatial resolutions, reaching up to the megapixel range, InfraTec offers a wide range of interchangeable lenses. As a result, accurate measurement of the smallest details of electronic components from a short distance is possible with IR camera systems using close-up and microscopic lenses.
Control of a circuit board
This information has been sourced, reviewed and adapted from materials provided by InfraTec GmbH.
For more information on this source, please visit InfraTec GmbH.