Using Active Thermography for Efficient Troubleshooting

Active Thermography

In the field of microelectronics, thermographic measurement and testing is considered to be very technologically challenging due to the requirement to detect temperature variations in the milli-Kelvin and micro-Kelvin range.

Those looking to investigate the question of where exactly defective parts and components are, need a particularly sensitive methodology.

Michael Schmidt, Specialist in Software Research and Development, InfraTec

The IRBIS® 3 active software by InfraTec is an ideal option for such tasks, fulfilling all the requirements and supporting analysis in which only a few micro-Kelvin separate defective and intact structures.

As the term "active" suggests, this IRBIS® software version is focused on the method of active thermography. Here, the cause of abnormalities, for instance, in integrated circuits, is determined by actively stimulating the corresponding components electronically. Using complex analysis algorithms, the IRBIS® 3 active can provide more robust results.

Clearly Determine the Location of Defects

Minimum thermal variations between defective and fully functional areas are one of the reasons why it is very difficult to find the exact location of defects. This is why the IRBIS® 3 active software allows for superimposition of different views at the pixel level, such as time with domain images, layout or visual images with amplitude or phase images. As a result, abnormalities can be successfully and precisely pinpointed at their locations. The menu allows users to easily adjust the desired degree of image superimposition.

Naturally, it is also possible to view the values for a selected measurement point separately for all angles of measurement and even perform simultaneous zooming for the respective views.

Easily Handle Measurements of Different Lengths of Time

In addition to the question of where abnormalities are present, the measurement period plays a key role in many analyses. Special tests may require several hours or even days for completion. In such cases, IRBIS® 3 active guarantees secure processing and storage for large amounts of data without any user intervention.

IRBIS® 3 active offers similar flexibility with regard to the pace of measurement. During measurements, rapid temperature changes often necessitate the use of high-frequency excitation so as to obtain sharper images. The so-called “under sampling” proves to be highly advantageous on site. This feature enables increasing the excitation frequency to a multiple of the thermal camera frame rate, thereby substantially increasing the areas of technical application.

Select and Secure Research Design Efficiently and Easily

Measurement time and measurement speed are two parameters illustrating how drastically research designs can vary based on the tests required. Still, users would often like to launch a measurement easily and with minimum effort. To achieve this, the test management feature of the IRBIS® 3 active enables various parameter settings to be set easily, carefully organized and rapidly retrieved. This feature reduces the preparation time and guarantees that measurement tasks can be carried out by different processors under identical conditions. This is one of the secrets of how thermographers are now able to address the challenges of working with microelectronics.

This information has been sourced, reviewed and adapted from materials provided by InfraTec GmbH.

For more information on this source, please visit InfraTec GmbH.


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