The Art of Customizing LED Assemblies

Table of Contents

Introduction
Optoelectronics Applications
Marktech Optoelectronics as Your Design Partner
Packaging Solutions
Conclusion

Introduction

When designing components or assemblies for specific products, electrical design engineers usually have to compromise some features for the benefit of others. When optimizing the performance of a particular product engineers can encounter a number of issues involving different electrical parameters, lead times and the physical size and cost.

These issues become complex when optoelectronic assemblies or components are being designed (Figure 1). This is because design engineers could be working with different wavelengths, materials, environmental factors and space constraints.

Figure 1. Engineer designing optoelectronic assemblies

Optoelectronics Applications

However, this complicated process can be made painless if you use an optoelectronic application expert, such as Marktech Optoelectronics. Marktech Optoelectronics provides unique solutions, which not only help users to optimize their product performance, but also allow them to keep their costs within their desired budget. Marktech Optoelectronics have been doing this for three decades, so they have a high level of expertise on complicated applications dealing with materials, LEDs, optical sensors,and other optoelectronic fields.

Marktech understand the specific goals of individual customers, and design custom assemblies and components. Marktech take their customers thought the entire manufacting process; from the chip level and engineering design through to both the testing and packaging of the product.

Marktech Optoelectronics as Your Design Partner

Figure 2. Optoelectronic component

Materials form the core component of optoelectronic products (Figure 2). Marktech Optoelectronics provides users with a wide range of commercial optoelectronic materials that span from short wave infrared (1720 nm) to deep ultra violet (280 nm) and everything in between. The company also provides detectors ranging from 150 to 2600 nm. Customers are guided to select the right material for their specific application needs.

Marktech Optoelectronics also help customers to choose the correct bin selections for both optical and electrical parameters like the wavelength, forward voltage, power output and more. This relatively shorter design cycle results in significant savings in both time and money.

Customers can use Marktech Optoelectronics’ sophisticated testing facilities, engineering expertise and quality control measures with the assurance that they are putting their monetary and technical resources to good use.

Packaging Solutions

Once a chip has been selected the next step is to determine a suitable package. Marktech Optoelectronics provides a variety of standard packaging options in addition to customized assemblies and components. Marktech provides surface mount devices; TO-5, T0- 18, TO-39, and TO-46 cans; 3 and 5 mm plastic, etc. and can place the selected chips within these packages as required.

Chip-on-board assemblies are also provided by Marktech Optoelectronics. These assemblies use a metal core such as copper or aluminum PCBs, a flexible and ceramic polyimide and also traditional FR-4 materials.

Conclusion

Once the assemblies or components are over, Marktec Optoelectronics will carry out a complete test, including a standardized QC analysis on its advanced, custom-designed electronic, radiometric and photometric measurement device. This is done to ensure whether these components and assemblies meet the customers’ desired electrical and optical parameters.

This information has been sourced, reviewed and adapted from materials provided by Marktech Optoelectronics.

For more information on this source, please visit Marktech Optoelectronics.

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