How Marktech does Optoelectronic Customization: Part One of Six

Table of Content

Introduction
Marktech’s Definition of Customization
Part 1: Custom Emission Materials
Part 2: Custom Detection Materials
Part 3: Packaging
Part 4: Custom Assemblies
Part 5: Design, Testing, and Binning
Part 6: Getting Started

Introduction

This article is the first installation in a six-part series focused on how Marktech performs optoelectronic customization – both detector and emitter components and assemblies that are custom designed for specific applications. The series will include detailed analysis of materials, testing, and packaging based on Marktech’s 30 years of experience in the optoelectronics field.

Customization: To make or modify individual preferences or specifications.

Marktech’s Definition of Customization

The process of learning about an application and making recommendations about how to optimize the performance of opto components or assemblies, resulting in the manufacture of end-products based on exact specifications - without production volume requirements.

This introduction about how Marktech performs optoelectronic customization is the first installation in a six-part series focused on both detector and emitter components and assemblies that are specifically designed for particular applications. The series will include a thorough analysis of materials, testing, and packaging based on Marktech’s 30 years of experience in the optoelectronics field.

With this series, the company aims to provide design engineers with details related to customized components and assemblies, such as physical constraints and how to optimize thermal, optical, and electrical characteristics.

Marktech’s upcoming series topics will be as follows:

Part 1: Custom Emission Materials

Does the application require tight binning? This post will explore how specific wavelengths can optimize the performance of products. It will explain how the choice of chip and other factors, including how to drive the component, will impact the lifetime and degradation of the product.

Which chip mounting options are best-suited for the application? This post will cover illumination patterns, die attach (eutectic or conductive paste), output, and wire bonding techniques. Another topic that will be discussed in detail includes a complete list of emitter chips ranging from deep UV to the visible range to short wave infrared (SWIR) and near-infrared.

Part 2: Custom Detection Materials

The detector chip has a customized design, which is a capability unique to Marktech. This post will cover the custom materials used in Marktech’s silicon detectors, including Avalanche photodiodes, photodiode arrays, PIN photodiodes, and other detector products.

The customers options will be reviewed to customize either P-type, N-type, or epi-materials in order to optimize chip design, to exceed or meet various specifications for characteristics like low crosstalk, fast response, low capacitance, minimum series resistance, low-dark current, and minimum reflection.

Part 3: Packaging

The packaging criteria should be considered after choosing the chip. It is essential to define what important criteria are required, for instance, space constraints. Packaging options include through-hole devices, chip on board (COB), surface mount devices (SMD), and TO-cans, including multi-chips, which may comprise of both detector and emitter chips.

Based on the user’s choice of package and chip, Marktech experts will determine what conditions the user may be dealing with, such as electromagnetic interference and heat dissipation. This post also explores lensing options to change radiation patterns, such as narrow or wide viewing angles, or custom illumination patterns.

Part 4: Custom Assemblies

Does the application require several chips, either for detection or emission or both? What is the best material for the assembly: FR-4 to metal core, flex, or ceramic? Based on the user’s specific application, Marktech’s custom design engineers will help to determine the number of chips needed according to drive and output conditions.

Marktech has completed assemblies ranging from two chips to 140; however, there are no limitations on the number of chips that can be mounted.

Part 5: Design, Testing, and Binning

Marktech can test for all electrical and optical parameters on detector and emission components, assemblies, and materials. The company also provides unique testing capabilities on detectors including quantum efficiency up to 3000 nm, spectral response up to 3000 nm, capacitance, dark current, and shunt resistance. On the emission side, Marktech provides complete testing on UV up to 2600 nm and down to 250 nm on SWIR devices.

All of Marktech’s services in design, testing, binning, and quality control will be covered in Part 5 in the series. Details about the company’s 10-step design and test process will be shared to ensure that the device works as intended, as well as to tailor services that meet users’ specific needs.

Part 6: Getting Started

Part 6 in the series provides a summary of Parts 1 through 5 and will also emphasize the next steps to be taken by users if they are interested in pursuing a custom device, beginning with preliminary discussions with one of Marktech’s application engineers. This part will discuss the steps that will help bring the user’s idea from concept to prototype to finished component or assembly.

This information has been sourced, reviewed and adapted from materials provided by Marktech Optoelectronics.

For more information on this source, please visit Marktech Optoelectronics.

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